| Certain Semiconductor Devices, Semiconductor Device Packages, and Products Containing Same |
337-TA-1010 |
Notice of a Commission Determination Extending the Dates for the Commission to Determine Whether to Review the Final ID and the Target Date |
Aug 9, 2017 |
| Certain Semiconductor Devices, Semiconductor Device Packages, and Products Containing Same |
337-TA-1010 |
Determination Extending the Target Date |
Nov 21, 2017 |
| Certain Semiconductor Devices, Semiconductor Device Packages, and Products Containing Same |
337-TA-1010 |
Notice of a Commission Determination to Extend the Target Date |
Dec 13, 2017 |
| Certain Semiconductor Devices, Semiconductor Device Packages, and Products Containing Same |
337-TA-1010 |
Notice of a Commission Determination Granting a Motion to Terminate the Investigation on the Basis of Settlement; Terminating the Investigation in its Entirety |
Dec 19, 2017 |
| Certain Semiconductor Devices, Semiconductor Device Packages, and Products Containing Same |
337-TA-1010 |
Notice of Commission Determination To Review In Part A Final Initial Determination Finding In Part A Violation Of Section 337 |
Sep 29, 2017 |
| Certain Semiconductor Devices, Wireless Infrastructure Equipment Containing the Same, and Components Thereof |
DN # 3532 |
Receipt of Complaint; Solicitation of Comments Relating to the Public Interest |
Feb 5, 2021 |
| Certain Semiconductor Devices, Wireless Infrastructure Equipment Containing the Same, and Components Thereof |
337-TA-1254DN # 3532 |
Institution of Investigation |
Mar 4, 2021 |
| Certain Semiconductor Devices, Wireless Infrastructure Equipment Containing the Same, and Components Thereof |
337-TA-1254 |
Commission Determination Not to Review an Initial Determination Granting a Joint Motion to Terminate the Investigation in its Entirety Based upon Settlement; Termination of Investigation |
Jul 30, 2021 |
| Certain Semiconductor Integrated Circuit Device and Products Containing Same |
DN # 2888 |
Notice of Receipt of Complaint; Solication of Comments Relating to the Public Interest |
Mar 26, 2012 |
| Certain Semiconductor Integrated Circuit Device and Products Containing Same |
337-TA-840 |
Notice |
Oct 1, 2012 |
| Certain Semiconductor Integrated Circuit Device and Products Containing Same |
337-TA-840 |
Instituion of investigation pursuant to 19 U.S.C. 1337 |
Apr 25, 2012 |
| Certain Semiconductor Integrated Circuit Device and Products Containing Same |
337-TA-840 |
Notice |
Jun 27, 2012 |
| Certain Semiconductor Integrated Circuits and Products Containing Same |
337-TA-665 |
Notice |
May 29, 2009 |
| Certain Semiconductor Integrated Circuits and Products Containing Same |
337-TA-665 |
Notice |
Jan 29, 2010 |
| Certain Semiconductor Integrated Circuits and Products Containing Same |
337-TA-665 |
Notice. |
Oct 30, 2009 |
| Certain Semiconductor Integrated Circuits and Products Containing Same |
337-TA-665 |
Notice |
Nov 10, 2009 |
| Certain Semiconductor Integrated Circuits and Products Containing Same |
337-TA-665 |
Notice |
May 29, 2009 |
| Certain Semiconductor Integrated Circuits and Products Containing Same |
337-TA-665 |
Institution of investigation pursuant to 19 U.S.C. 1337 |
Dec 18, 2008 |
| Certain Semiconductor Integrated Circuits Using the Tungsten Metallization and Products Containing Same |
337-TA-648 |
Institution of investigation pursuant to 19 U.S.C. 1337 |
May 15, 2008 |
| Certain Semiconductor Integrated Circuits Using the Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Sep 2, 2008 |
| Certain Semiconductor Integrated Circuits Using the Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Oct 8, 2008 |
| Certain Semiconductor Integrated Circuits Using the Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Nov 19, 2008 |
| Certain Semiconductor Integrated Circuits Using the Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Dec 8, 2008 |
| Certain Semiconductor Integrated Circuits Using the Tungsten Metallization and Products Containing Same |
731-TA-648 |
Notice |
Oct 17, 2008 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice. |
Jan 21, 2010 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Mar 22, 2010 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Jul 20, 2009 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Aug 19, 2009 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Nov 23, 2009 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Nov 30, 2010 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Order |
Nov 30, 2010 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Dec 22, 2008 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Jan 29, 2009 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Feb 9, 2009 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Mar 31, 2009 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Apr 23, 2009 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice (Order No. 66) |
Apr 23, 2009 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
May 13, 2009 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Jul 15, 2009 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice |
Jun 29, 2009 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice Of A Commission Determination Not To Review Initial Determinations Terminating The Investigation As To National Semiconductor Corporation And Micronas GMBH |
Aug 5, 2009 |
| Certain Semiconductor Integrated Circuits using Tungsten Metallization and Products Containing Same |
337-TA-648 |
Notice of a Commission Determination Not To Review An Initial Determination Terminating The Investigation As To Dongbu Hitek Semiconductor Business |
Aug 5, 2009 |
| Certain Semiconductor Lithography Systems and Components Thereof |
DN # 3341 |
Notice of Receipt of Complaint; Solicitation of Comments Relating to the Public Interest |
Sep 13, 2018 |
| Certain Semiconductor Lithography Systems and Components Thereof |
337-TA-1137DN # 3341 |
Notice of Institution of Investigation |
Oct 9, 2018 |
| Certain Semiconductor Lithography Systems and Components Thereof |
337-TA-1137 |
Commission Determination Not to Review an Initial Determination Terminating the Investigation in its Entirety |
Apr 4, 2019 |
| Certain Semiconductor Products Made By Advanced Lithography Techniques and Products Containing Same |
337-TA-729 |
Institution of investigation pursuant to 19 U.S.C. 1337 |
Jul 21, 2010 |
| Certain Semiconductor Products Made By Advanced Lithography Techniques and Products Containing Same |
337-TA-729 |
Notice |
Dec 8, 2010 |
| Certain Semiconductor Products Made By Advanced Lithography Techniques and Products Containing Same |
337-TA-729 |
Notice |
Dec 21, 2010 |
| Certain Semiconductors and Devices and Products Containing the Same, Including Printed Circuit Boards, Automotive Parts and Automobiles |
337-TA-1332 |
Commission Determination Not to Review an Initial Determination Terminating the Investigation in Part Based on Withdrawal of Certain Claims |
Jan 12, 2023 |
| Certain Semiconductors and Devices and Products Containing the Same, Including Printed Circuit Boards, Automotive Parts, and Automobiles |
DN # 3637 |
Receipt of Complaint; Solicitation of Comments Relating to the Public Interest |
Aug 24, 2022 |