Thursday, September 28, 2017
Wafer-Level Packaging Semiconductor Devices
Bert C. Reiser
Latham and Watkins LLP
Tessera Advance Technologies, Inc.
Letter to Lisa R. Barton, Secretary, USITC; requesting that the Commission conduct an investigation under section 337 of the Tariff Act of 1930, as amended, regarding Certain Wafer-Level Packaging Semiconductor Devices and Products Containing Same (Including Cellular Phones, Tablets, Laptops, and Notebooks) and Components Thereof. The proposed respondents are Samsung Electronics Co., Ltd., Korea; Samsung Electronics America, Inc., Ridgefield Park, NJ; and Samsung Semiconductor, Inc., San Jose, CA.